Eitre 3


The EITRE® 3 systems are very versatile tools for areas in solid-state lighting, micro optical and photonic components, patterned media, bio-medical and life science, lab-o-chip, MEMS/NEMS and semiconductors.All Nano Imprint Lithography (NIL) systems can be configured to perform full area imprint based on patented SoftPress® technology. The unique and superior design of the heater, embedded in the substrate chuck, provides a uniform temperature distribution across the whole imprint area. This excellent temperature control and flexible setting possibilities, makes it possible to use a wide range of imprint polymer.

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KEY TECHNOLOGIES

SoftPress®
With ObducatSoftPress® technology, pressure is applied to the stamp and substrate using compressed air to ensure pressure uniformity over the entire imprint area. This permits stamp and substrate to conform to each other and thus eliminating adverse effects from thickness variations, bow or waviness in stamp or substrate. SoftPress® therefore permits thin and uniform residual layer over large areas, which is important for high-resolution printing and pattern transfer fidelity.

Animation of imprint full area


IPS® - Intermediate Polymer Stamp
The patented Intermediate Polymer Stamp, IPS®, permits contamination control and extend the stamp lifetime via a two-step process that eliminate the contact between the hard master stamp and the hard substrate. The master stamp is instead replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate. Thus the IPS® technologyextensively impacts the overall costs associated with NIL, making the Obducat NIL the most cost economical system on the market.



STU® - Simultaneous Thermal and UV
Obducat's proprietary STU® technology allows both simultaneously combined UV and thermal NIL and thereby enable the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. This approach is adopted to prevent problems pertaining to different thermal expansions in both substrate and materials and stamp. This method also permits the use of spin-coated UV-curable polymers with a homogeneous thickness distribution on wafer scale that is important for CD control as well as allowing pattern transfer to an underlying substrate.

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