Eitre 6


The EITRE® 6 Nano Imprint Lithography (NIL) Systems provide a manual and affordable lithography solution that enable pattern replication both in the micro- and nanometer range. The embedded SoftPress® technology is vital as it provide excellent residual layer thickness control across the entire imprint area and allowing an accurate pattern transfer.

The system is also very versatile as it can be configured for a variety of imprint processes to be used including hot embossing, UV NIL,thermal NIL, and Obducat's unique Simultaneous Thermal and UV (STU®) process.

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  • Full area imprint
  • Softpress® technology
  • User-friendly interface
  • Multiple imprint process capability
  • Wide range of configuration possibilities
  • Sub-20nm residual layer thickness

KEY TECHNOLOGIES

SoftPress®
With ObducatSoftPress® technology, pressure is applied to the stamp and substrate using compressed air to ensure pressure uniformity over the entire imprint area. This permits stamp and substrate to conform to each other and thus eliminating adverse effects from thickness variations, bow or waviness in stamp or substrate. SoftPress® therefore permits thin and uniform residual layer over large areas, which is important for high-resolution printing and pattern transfer fidelity.

Animation of imprint full area


IPS® - Intermediate Polymer Stamp
The patented Intermediate Polymer Stamp, IPS®, permits contamination control and extend the stamp lifetime via a two-step process that eliminate the contact between the hard master stamp and the hard substrate. The master stamp is instead replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate. Thus the IPS® technology extensively impacts the overall costs associated with NIL, making the Obducat NIL the most cost economical system on the market.



STU® - Simultaneous Thermal and UV
Obducat's proprietary STU® technology allows both simultaneously combined UV and thermal NIL and thereby enabling the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. This approach is adopted to prevent problems pertaining to different thermal expansions in both substrate and materials and stamp. This method also permits the use of spin-coated UV-curable polymers with a homogeneous thickness distribution on wafer scale that is important for CD control as well as allowing pattern transfer to an underlying substrate.

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