Rtec UP-5000 3D Optical Profilometer: Next-Generation Multi-Mode Metrology Platform
LMS Technologies Pte Ltd introduces the Rtec UP-5000, the premier non-contact 3D surface metrology solution engineered for Singapore’s advanced manufacturing, academic research, and high-tech industrial sectors. Serving as the flagship model of the UP Series, this system delivers uncompromised analytical power to bridge the gap between micro- and nano-scale surface topographies.
Unmatched Capacity, Uncompromised Precision
Designed with an expansive, fully automated 300 x 300 x 150 mm XYZ stage and a robust 150-mm Z-axis integrated with an advanced encoder, the UP-5000 provides the ultimate freedom to handle large-scale, heavy, or multi-sample arrays without sacrificing precision. From academic material characterization to rigorous high-tech quality control (QC), the UP-5000 seamlessly bridges the gap from nano-scale to micro-scale topographies.
5 Core Imaging Modes + Advanced Modularity in One Single Head
The true engineering genius of the Rtec UP-5000 lies in its multi-mode versatility. With just a single click, the system automatically switches between five distinct optical imaging modes directly within the microscope head. This eliminates sample relocation artifacts and ensures total data co-localization.
- White Light Interferometry (WLI): Delivers the highest Z-axis resolution on flat surfaces, achieving sub-nanometer height precision completely independent of magnification.
- Spinning Disk Confocal Microscopy: Utilizing Rtec’s proprietary Nipkow Confocal (Lambda Head) with thousands of simultaneous pinholes, this mode offers the fastest area scanning on the market, retrieving precise data from steep slopes (up to 72°) and rough or transparent materials.
- Bright Field Mode: Provides ultra-high-speed, ultra-high-resolution real color 2D imagery.
- Dark Field Mode: Accentuates contrast to capture micro-cracks, surface defects, and hidden structural failures invisible to standard optics.
- Focus Variation: Rapidly maps the overarching geometric shape and yields sharp, completely unifocus topologies across wide testing areas.
Beyond 3D Profilometry: Future-Proof Expandability
The UP-5000 is uniquely modular. Beyond its 5 core modes, it can be seamlessly upgraded to integrate premium analytical tools including an Atomic Force Microscope (AFM), Raman Microscope, and Spectral Reflectance Profilometry for advanced thin-film and coating thickness inspection.
Engineered for Limitless Applications
No matter the surface condition—be it transparent, rough, dark, reflective, or non-flat—the UP-5000 delivers precise quantitative reports for Singapore’s core industries:
Semiconductors & Wafers
Semiconductors & Wafers
- Inspect wafer bumps, microfluidic channels, vias, pellicles, and advanced microstructures.
- Accommodates full wafers up to 300mm.
- Characterize additive manufacturing (3D printed) surfaces.
- Execute wear volume calculations, scratch tracks, and Vickers hardness indentations.
- Assess contact lenses, micro-lens arrays, and glass topography.
- Evaluate thin-film uniformity and multi-layer reflection mapping.
Intelligent Automation & Compliance
The UP-5000 is built for absolute ease of operation. The entire surface analysis workflow is fully automatic—requiring zero specialized operator expertise to achieve professional results. With a single button click, the system acquires real color data, executes automatic image stitching across immense surface areas, and outputs standardized quality documentation.
- Software Power: Native integration with standard-setting MountainsMap® software for deep-dive 3D wave tracking, volumetric analysis of wear/holes, roughness distribution, and particle sizing.
- International Traceability: Completely complies with global tracing frameworks including ISO 25178, ISO 4287, ISO 16610, and EUR 15178.
- Smart Quality Control: Program customized pass/fail criteria paired with clear green/red traffic light visuals for any selected testing parameter, optimizing high-throughput QC pipelines.
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SPECIFICATIONS
BROCHURE
SPECIFICATIONS
| XYZ Stage Travel Range | 300 x 300 x 150mm (High-precision cross-roller XY stage) |
| Z-Axis Encoder | Advanced high-resolution encoder with 150-mm travel |
| Standard Imaging Modes | White Light Interferometry (WLI), Spinning Disk Confocal, Bright Field, Dark Field, Variable Focus Imaging |
| Advanced Modular Upgrades | Atomic Force Microscopy (AFM), Raman Microscope, Spectral Reflectance (Coating Thickness) |
| Interferometry Vertical Resolution | Better than 0.01 nm |
| Interferometry RMS Repeatability | 0.01 nm |
| WLI Light Sources | User-selectable 4-color LED (White, Red-630nm, Green-530nm, Blue-460nm) |
| Scanning Speed Capabilities | High-speed cameras running 250 FPS+ for rapid stitching |
BROCHURE
| 3D Optical Profilometers UP Series-2026 |  Free Download PDF >> |
3D OPTICAL PROFILMETERS
3D OPTICAL PROFILMETERS