Rtec UP-3000 3D Optical Profilometer: The High-Efficiency Industrial Workhorse
LMS Technologies Pte Ltd presents the Rtec UP-3000, a highly versatile and dependable multi-mode surface profiler optimized for high-throughput laboratory and industrial environments in Singapore. Positioned as the reliable workhorse of the Rtec portfolio, the UP-3000 provides high-precision, non-contact 3D surface measurements in a streamlined, space-saving layout.
Built with a flexible 150 x 200 x 150 mm XYZ configuration and high-precision cross-roller guidance, the UP-3000 accommodates a wide array of component sizes. Its compact optical head features a unique dual high-speed camera setup that independently optimizes individual light paths. This architecture maximizes image clarity and acquisition speeds, making it excellent for automated component inspection and rapid failure analysis.
Built with a flexible 150 x 200 x 150 mm XYZ configuration and high-precision cross-roller guidance, the UP-3000 accommodates a wide array of component sizes. Its compact optical head features a unique dual high-speed camera setup that independently optimizes individual light paths. This architecture maximizes image clarity and acquisition speeds, making it excellent for automated component inspection and rapid failure analysis.
Integrated 5-in-1 Surface Characterization
The UP-3000 replaces the need for separate, single-purpose inspection systems. It allows users to programmatically toggle between five core imaging techniques inside a single optical head, capturing holistic surface profiles without manual sample repositioning:
- Spinning Disk Confocal Microscopy: Utilizing the proprietary Nipkow Lambda head design, this mode enables exceptionally fast area scans with nanometer-scale resolution—even on challenging transparent materials or steep surface features up to 72°.
- White Light Interferometry (WLI): Delivers elite, sub-nanometer Z-axis resolution on reflective and smooth surfaces, ensuring consistent measurement accuracy across all objective magnifications.
- Focus Variation (Variable Focus): Efficiently creates fully focused 3D topographical maps across large sample dimensions at high speeds.
- Bright Field Microscopy: Supplies high-resolution, vivid color 2D imaging for quick surface reviews and rapid panoramic stitching.
- Dark Field Microscopy: Maximizes image contrast to isolate micro-defects, deep scratches, and structural anomalies that traditional optics cannot resolve.
Tailored for Cross-Industry Challenges
The UP-3000 scales seamlessly from nano-scale research to micro-scale industrial quality control:
- Semiconductors & Electronics: Efficient inspection of MEMS structures, microfluidic channels, wafer micro-features, and circuit vias.
- Coatings & Tribology: Direct quantification of thin-film thickness, scratch test behaviors, surface porosity, and 3D waviness patterns.
- Advanced Manufacturing: Evaluation of 3D-printed metal finishes, wear scar volumes, and traditional precision tooling tolerances.
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SPECIFICATIONS
BROCHURE
SPECIFICATIONS
| XYZ Stage Travel Range | 150 x 200 x 150mm (High-precision cross-roller XY stage) |
| Z-Axis Encoder | Advanced high-resolution encoder with 150-mm travel |
| Standard Imaging Modes | White Light Interferometry (WLI), Spinning Disk Confocal, Bright Field, Dark Field, Variable Focus Imaging |
| Interferometry Vertical Resolution | Better than 0.01 nm |
| Interferometry RMS Repeatability | 0.01 nm |
| WLI Light Sources | User-selectable 4-color LED (White, Red-630nm, Green-530nm, Blue-460nm) |
| Scanning Speed Capabilities | High-speed cameras running 250 FPS+ for rapid area coverage |
BROCHURE
| 3D Optical Profilometers UP Series-2026 |  Free Download PDF >> |
3D OPTICAL PROFILMETERS
3D OPTICAL PROFILMETERS